【直播介绍】Xue FengTsinghua Univers

直播时间:2023年4月14日(周五):00-21:30

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2023年4月14日晚上8点，北京时间iCANX Talks 第139期将在iCANX平台上推出！本期邀请清华冯雪教授分享！更精彩，请期待！

【直播介绍】

Xue Feng

Tsinghua University

Flexible integrated circuits: design, manufacture and applications

【Abstract】

Flexible electronics technology refers to the integration of different materials and functional units on flexible substrates to form thin, flexible, deformable and reconfigurable electronic devices/systems. It subversively changes the rigid physical form of traditional electronic devices. The core of flexible electronics technology is the design, manufacture and reliability of flexible integrated devices.

柔性电子技术是指将不同的材料和功能单元集成在柔性衬底上，形成薄、柔性、变形、可重构的电子设备/系统。它颠覆性地改变了传统电子设备刚性的物理形式。柔性电子技术的核心是柔性集成设备的设计、制造和可靠性。

This talk firstly introduces the design theory and manufacture of flexible integrated devices, including the evolution mechanism of semiconductor properties under deformation and the integration method of transfer printing on heterogeneous interfaces. For wafer level manufacturing of flexible integrated devices, nanometer diamond enhanced wafer grinding method is used, which can thin 4-12 inch wafer to 25 microns. With ultra-thin chips transfer and high energy laser beam slicing, the single flexible chips with independent function are obtained.

本演讲首先介绍了柔性集成器件的设计理论和方法，包括下半导体性能演化机制、异质界面转移印刷集成方法等。对于柔性集成器件的晶圆级制造，采用纳米金刚石强化晶圆研磨方法～将12英寸晶圆薄化到25微米，进行超薄晶圆转移和高能激光束切片，获得具有独立功能的单个柔性芯片。

Then the flexible chips are picked up, transferred, interconnected, encapsulated and integrated, and finally the flexible integrated devices are formed. The first small test line of flexible integrated device manufacturing domestic and abroad and the CNAS standard testing and certification system have been established, and ultra-thin flexible chips, high-density packaging of flexible chips, high-precision SMT of flexible circuit boards and low-temperature silicone injection encapsulation have been realized from chip level to module level manufacturing. The above technologies greatly promote the innovation and development of flexible integrated devices and their applications in health care, intelligent perception, major equipment and other fields.

然后对柔性芯片进行拾取、转移、连接、包装和集成，最终形成柔性集成器件。建立了国际国内首条柔性集成器件制造试验线和数控标准检测认证体系，实现从芯片级到模块级的超薄柔性芯片、柔性芯片高密度包装、柔性电路板高精度SMT、低温硅胶注塑包装。上述技术极大地促进了柔性集成器件的创新发展及其在健康医疗、智能感知、重大设备等领域的应用。

【BIOGRAPHY】

Xue Feng, male, born in 1977, Professor of Tsinghua University, 973 Project Chief Scientist, currently director of Flexible Electronic Technology Laboratory of Tsinghua University, President of Zhejiang Tsinghua Flexible Electronic Technology Research Institute, etc.

冯雪，男，1977年出生，清华大学长聘教授，国家973首席科学家，国家杰青，现任清华大学柔性电子技术实验室主任，浙江清华柔性电子技术研究所院长。

Professor Feng Xue is committed to solid mechanics and flexible electronics technology. So far, he has published more than 260 SCI papers in Nat. Mater., Sci. Adv., Adv Mater. More than 190 national invention patents and 9 software Copyrights were authorized. He has won the Heliang Heli Foundation Science and Technology Innovation Award, China Youth Science and Technology Award, National Outstanding Scientist of Science and Technology, Qiushi Outstanding Youth Award of China Association for Science and Technology, etc. Ranked in 1st, he has won the first prize of Beijing Natural Science, the first prize of Technology Invention of the Ministry of Education and many other awards.

冯雪教授致力于研究固体力学和柔性电子技术，到目前为止在Nat. Mater.、Sci. Adv.、Adv. Mater.、Natl. Sci. Rev.、JMPS发表了260多篇SCI论文；授权国家发明专利190余项，独立软件作权9项；何梁何利基金科技创新奖、中国青年科技奖、全国优秀科技工作者、中国科技协会优秀青年奖等。获得北京市自然科学一等奖、教育部技术发明一等奖等多项省部级和学会奖。